Copper Base PCB | Metal Core PCB
Leverage TriWin’s advanced Copper Base PCB technology and expert PCB manufacturing to achieve superior heat dissipation, unmatched thermal performance, and enduring reliability for your most demanding high-power electronics and high-frequency circuits. As a leading Copper Core PCB manufacturer, TriWin provides custom PCB solutions that empower your innovations.
What are Copper Base PCBs?
Copper Base PCBs, also known as Copper Core PCBs or Copper Substrate PCBs, represent a specialized category within Metal Core PCBs (MCPCBs). Unlike conventional FR-4 PCBs or standard Aluminum PCBs, the foundational substrate in our Copper Base PCBs is a solid, high-purity copper plate. This construction leverages copper’s inherent high thermal conductivity to enable efficient heat dissipation in demanding electronic environments.
The structure of a TriWin Copper Base PCB consists of three precision-engineered layers:
Circuit Layer: This layer features copper foil, with thicknesses ranging from 35μm to 280μm. It’s designed to handle high current-carrying capacity, ensuring stable electrical performance in power electronics and high-load circuits.
Thermally Conductive Insulating Layer: This critical dielectric layer is composed of materials like aluminum oxide and silicon powder filled with epoxy resin. It offers low thermal resistance (typically 0.15), good viscoelasticity, and resistance to thermal aging, efficiently transferring heat from components to the copper base while maintaining electrical isolation.
Copper Base: The core copper plate provides robust structural support and serves as the primary heat sink. Its high thermal conductivity (copper material itself is 300 W/m·K to 400 W/m·K) aids in effective heat dissipation, electromagnetic shielding, and offers excellent machinability.

PCB manufacturing
Key Advantages of TriWin Copper Base PCBs
TriWin Circuits’ Copper Base PCBs provide distinct advantages, making them a strong choice for high-performance applications
Efficient Thermal Management: Our copper-based PCBs efficiently dissipate heat, leveraging copper’s high thermal conductivity. This helps reduce component operating temperatures, contributing to extended component lifespan and enhanced reliability. It can also help minimize the need for additional heat sinks in certain designs.
Reliability & Durability: The inherent strength of copper combined with TriWin’s manufacturing processes ensures mechanical stability and long-term reliability in various operating conditions. Copper’s high mechanical strength (elastic modulus of 121,000 MPa) provides robust performance compared to aluminum (elastic modulus: 72,000 MPa).
High Power & High Current Capability: TriWin’s ability to integrate thicker copper foils allows components to operate at higher power levels and manage larger currents effectively. This is beneficial for applications requiring high power density.
Design Adaptability & Cost Optimization: The thermal efficiency of TriWin’s Copper Base PCBs can simplify overall system design by potentially reducing the size or complexity of external cooling solutions. This may lead to more compact products and contribute to optimized system costs.
Thermal Cycling & Aging Resistance: Our selected materials and bonding processes contribute to stable performance under thermal cycling and prolonged operation, supporting long-term product integrity.

Copper Base PCB Design Considerations
To optimize your copper-based PCB design and ensure performance, consider the following guidelines:
Minimum Drilling Diameter: A minimum drilling diameter of 0.4mm is recommended.
Line Width and Spacing: Adjust traces and spacing based on copper foil thickness; thicker foils (e.g., 280μm) may require wider lines and larger spacing for optimal integrity.
Thermal and Mechanical Design: For complex designs, consider routing, assembly, heat dissipation pathways, mechanical stress, and signal integrity.
Surface Finish Selection: Choose a surface finish that aligns with your application’s environmental conditions, assembly requirements, and budget.

Copper Base PCB vs. Aluminum PCB
TriWin Circuits offers both Copper Base PCBs and Aluminum Base PCBs as part of our metal core PCB portfolio. Here’s a comparison to help you choose the right solution:
Feature | Copper-Based PCB (TriWin) | Aluminum-Based PCB (TriWin) | |||||
Thermal Conductivity (Overall) | Generally higher effective thermal conductivity for the full stack due to copper base | Lower than copper, but superior to FR-4 | |||||
Weight | Heavier | Lightweight | |||||
Cost | Generally more expensive | Cost-effective | |||||
Dimensional Stability | Higher (elastic modulus: 121,000 MPa) | Lower (elastic modulus: 72,000 MPa) | |||||
Machinability | Supports metalized holes, complex patterns, intricate etching | More limited compared to copper | |||||
Applications | High-power LEDs, automotive (critical systems), aerospace, high-end power electronics | Low-power lighting, general electronics, cost-sensitive projects |
Copper-based PCBs are chosen for applications requiring maximum heat dissipation, high reliability, and top performance, particularly in critical or high-power scenarios. Aluminum PCBs are a robust and cost-effective solution for less thermally demanding projects. Our experts can help you make an informed decision for your specific needs.
Surface Finish Options for Copper Base PCBs
To meet diverse assembly and environmental requirements, TriWin offers Copper Base PCBs with various surface finish options:
Immersion Gold (ENIG): RoHS-compliant, provides good conductivity, suitable for fine-pitch components and wire bonding.
Silver-Plated (Immersion Silver): Offers good conductivity, oxidation resistance, and can be a cost-effective alternative.
Hot Air Solder Level (HASL Lead-Free): An economical finish, suitable for larger components, available in lead-free options.
Immersion Tin: Provides good flatness and solderability.
Anti-Oxidation (OSP): An organic surface protectant that is environmentally friendly and provides a flat, solderable surface.
ENEPIG: Electroless Nickel Electroless Palladium Immersion Gold offers good wire bonding capability and corrosion resistance.

TriWin Copper Base PCB Capabilities
At TriWin, we provide customized Copper Base PCB solutions tailored to your specific project needs. Our capabilities ensure optimal performance and manufacturability for your designs.

Parameter | Specification (Customizable) | |||
Layers | 1 Layer (or specific custom configurations for multilayer metal core PCBs) | |||
Base Material | High-Purity Copper Plate | |||
Finished Board Thickness | 1.0 mm – 3.0 mm (1.6 mm standard) | |||
Finished Copper Thickness | 1 oz – 8 oz (typically up to 280μm for heavy copper PCBs) | |||
Surface Treatments | HASL Lead-Free, OSP, ENIG (Immersion Gold), ENEPIG, Immersion Tin, Immersion Silver | |||
Solder Mask | White, Black, or other specified colors | |||
Typical Thermal Conductivity | 2 W/m·K (for the dielectric layer; the overall PCB benefits from the highly conductive copper base) | |||
Certifications | UL, ISO, IATF, SGS Compliant | |||
Special Features | Complex Component Footprint Matching, Copper Convex/Concave Blocks, Multi-Point Thermal Pad Layouts, SinkPAD PCB integration |
Specialized Offerings: SinkPAD PCBs
TriWin Circuits also manufactures SinkPAD PCBs, a specialized type of copper-based PCB designed for extreme heat dissipation. Featuring a direct thermal path from heat-generating components to the copper base, SinkPAD PCBs are ideal for the most thermally challenging applications
- High-power LEDs (e.g., COB, automotive lighting)
- High-density power electronics
- Automotive lighting systems
- Aerospace and defense systems

Your Strategic Partner in Ceramic PCB Manufacturing: Why TriWin?
Choosing TriWin means partnering with a specialist in Ceramic PCB manufacturing, dedicated to delivering the highest standards of quality and performance for your critical applications.
Specialized Expertise: We possess a deep understanding of ceramic materials and complex ceramic PCB fabrication processes, enabling us to tackle the most challenging designs with precision.
Advanced Fabrication Technologies: Our state-of-the-art facilities are equipped with specialized machinery for ceramic manufacturing, including precision laser drilling, high-temperature co-firing capabilities, and Direct Copper Bonding (DCB) techniques, ensuring superior accuracy and performance.
Uncompromising Precision & Reliability: We emphasize tight tolerances and co
nsistent quality critical for ceramic PCBs, ensuring optimal thermal and electrical performance over time.
Comprehensive Quality Assurance: Every ceramic PCB undergoes rigorous testing, including AOI, electrical testing, and X-ray inspection, to guarantee reliability and adherence to specifications.
Diverse Material Sourcing: We work with various high-quality ceramic substrates (Alumina, AlN) to provide the best material solution for your project’s specific thermal and electrical requirements.
Industry Certifications: Our adherence to ISO9001, IATF16949 (Automotive standard), ISO14001 (Environmental), and UL certifications underscores our commitment to quality, responsible manufacturing, and product safety.