Copper base PCB

Basic parameters (Customizable):

What is copper base PCB?

Copper substrate is one of the most expensive metal substrate, the thermal conductivity effect is many times better than aluminum substrate and iron substrate, suitable for high-frequency circuits and areas with large changes in high and low temperature and precision communication equipment heat dissipation and building decoration industry. Copper substrate is a kind of substrate material commonly used in electronic products, its heat dissipation performance is excellent, can effectively reduce the temperature of electronic components, improve the stability and reliability of electronic products.

Generally surface treatments for copper base PCB are immersion gold (ENIG), immersion silver, HASL LF, OSP and so on. The circuit layer of the copper base PCB requires a large current carrying capacity, so thicker copper foil should be used, the thickness is generally 35μm~280μm; Thermal insulation layer is the core technology of copper substrate. The core thermal conductivity component is composed of aluminum oxide and silicon powder and epoxy resin filled polymer. It has low thermal resistance (0.15), excellent viscoelastic property, thermal aging resistance, and can withstand mechanical and thermal stress. The metal base is the supporting component of the copper substrate, which requires high thermal conductivity, generally copper plate, can also use copper plate (which copper plate can provide better thermal conductivity), suitable for drilling, punching and cutting and other conventional mechanical processing.

Features:

1.High thermal conductivity. The thermal conductivity of the copper substrate is very good, better than that of the aluminum substrate and iron substrate, making it excellent in applications requiring efficient heat dissipation, such as high power density electronic devices.

2.High electrical and mechanical properties. Copper has good electrical conductivity and stability, which ensures the reliability of the substrate in complex environments.

3.High processing capacity. The copper substrate can be drilled, punched, cut and other conventional mechanical processing.

4.Good coefficient of thermal expansion. Copper substrate has a small coefficient of thermal expansion, which is conducive to maintaining equipment stability.

5.High mechanical strength. Copper substrate has high mechanical strength and is suitable for applications in high-end electronic displays, communication products and other fields.

6.Long life and high tolerance. Copper substrates have long life and high tolerance for applications requiring high performance and reliability.

7.Excellent thermal aging resistance, which has excellent viscoelastic properties and thermal aging resistance.

8.High current carrying capacity. Copper substrate circuit layer requires a large current carrying capacity, usually using thicker copper foil.

Applications：

Widely used in electronic products, solar cells, power supplies, automotive electronics, medical devices and other fields, especially in the field of LED lighting, the heat dissipation performance of copper substrate is particularly important, can effectively extend the service life of LED lights.