Thermoelectric separation (sink PAD) PCB

Basic parameters (Customizable):

What is thermoelectric separation copper base PCB?

The thermoelectric separation of copper substrate refers to a thermoelectric separation process of copper substrate processing, the circuit part and the thermal part are on different layers, and the thermal layer part is directly in contact with the heat dissipation part of the lamp bead to achieve the best heat dissipation and heat conduction effect. The thermal conductivity of the thermoelectric separation copper substrate reaches 380-400W/M.K, the shortcomings is solved of the thermal conductivity and heat dissipation of the traditional copper substrate. This process is to conduct the heat generated by electronic components directly through the heat dissipation zone and greatly improve the heat dissipation effect.

Features:

1.The thermoelectric separation structure is adopted, and the contact with the lamp bead is zero thermal resistance, which greatly reduces the lamp bead decay and prolonging the lamp bead life.

2.Copper substrate has the characteristic of high density, strong thermal carrying capacity, good heat conduction and heat dissipation，while the same power has smaller volume.

3.Suitable for matching a single high-power lamp bead, especially COB package, so that the lamp to achieve better results.

4.According to different needs can be carried out a variety of surface treatment (OSP, HASL LF, Immersion gold, plating gold, immersion silver, silver plating, etc.).

5.According to the different design needs of the lamp, different structures can be made (copper convex block, copper concave block, thermal layer and trace layer parallel).

Applications：

Thermoelectric separation copper substrate is widely used in high power heat dissipation scenarios, such as LED lights, LED color light modules and so on