Ceramic base PCB

Basic parameters (Customizable):

What is ceramic PCB?

Ceramic PCB is put together by bonding the copper foil and ceramic substrate under high temperature environment, with

Strong bonding force, copper foil will not fall off, high reliability, stable performance under high temperature and high humidity environment.

Ordinary  PCB is usually bonded by copper foil and substrate, and most of the substrate material for the glass fiber (FR-4), phenolic resin (FR-3) and other materials, adhesives are usually phenolic, epoxy, etc.. In the PCB processing process due to thermal stress, chemical factors, improper production process, or in the design process due to the asymmetry of the two sides of the copper laying, it is easy to lead to warp and twist (warpage) appearance of the PCB board.

The heat dissipation performance, current-carrying capacity, insulation, thermal expansion coefficient, etc., are much better than ordinary glass fibre PCB boards.

Features:

1.Mechanical properties

Sufficiently high mechanical strength, in addition to piggybacking elements, can also be used as a support component; good processability, high dimensional accuracy; easy to achieve multi-layer;Smooth surface, no warping, bending, micro-cracks, etc.

2.Electrical properties

High insulation resistance and insulation breaking voltage;

Low dielectric constant;

Low dielectric loss;

Stable performance under conditions of high temperature and humidity to ensure reliability.

3.Thermal properties

High thermal conductivity;

The coefficient of thermal expansion is matched with the related materials (especially the coefficient of thermal expansion with Si should be matched);

Excellent heat resistance.

4.Other properties

Good chemical stability; easy metallisation, strong adhesion of circuit graphics to it;

No hygroscopicity; resistant to oil and chemicals; low a-ray emission;

The substances used are harmless and non-toxic; the crystal structure does not change within the temperature range;

Abundant raw materials; mature technology; easy to manufacture; low price.

Applications:

• High-power electronic modules, solar panel modules, Semiconductor Coolers, Electronic Heaters; RF Power Control Circuits, Power Mixing Circuits,
• Intelligent Power Components, High Frequency Switching Power Supplies, Solid State Relays
• Automotive electronics, aerospace, military electronics
• High Power LED Lighting Products, Solar panel components; telecommunication switchboards and reception systems; lasers and other industrial electronics.
• Communication antenna, car ignition.