PCB Capability
| Item | Specific | Capability |
| Overall production capability | Layer quantity | 1-30 layers |
| High frequency mixed laminate HDI | Ceramic materials, PTFE materials can only be mechanically drilled blind holes or controlled depth drilling, | |
| back drilling, etc. (can not laser drilling, can not directly press copper foil) | ||
| High speed HDI | Made according to regular HDI | |
| Laser stages | 1-5 stages (if ≥ 6stages, need review) | |
| Thickness scope | 0.1-5.0mm (if ＜0.2mm, or ＞6.5mm, need review) | |
| Min. finish size | Individual board 5*5mm (if ＜3mm, need review) | |
| Max. finish size | 2-20 layers is 21*33inch; (if short edge ＞ 21inch, need review) | |
| Max. finish copper thickness | External layer 8OZ (if ＞8OZ, need review)，Inner layer 6OZ (＞6OZ, need review) | |
| Min. finish copper thickness | 1/2oz | |
| Layers alignment | ≤3mil | |
| Board thickness scope for epoxy filled vias | 0.254-6.0mm，epoxy filled vias for PTFE board need review | |
| Board thickness tolerance | Board thickness ≤1.0mm；±0.1mm | |
| Board thickness ＞1.0mm；±10% | ||
| Impedance tolerance | ±5Ω (＜50Ω)，±10% (≥50Ω)；±8% (≥50Ω，need review) | |
| Warp and twist (warpage) | General: 0.75%，Limit: 0.5% (need review) max. 2.0% | |
| Press times | One core ≤ 5 times (＞3 times need review) | |
| Material type | General Tg FR4 | Shengyi S1141、Kingboard KB6160A、Goldenmax GF212 |
| Mid Tg FR4 | Shengyi S1150G、Kingboard KB6165F、Kingboard KB6165G (halogen free),IT158 | |
| High Tg FR4 | Shengyi S1165 (halogen free)、Kingboard KB6167G (halogen free)、Kingboard KB6167F | |
| Aluminum base | GoldenmaxGL12、Boyu 3 series、1-8 layers mixed laminated FR-4 | |
| HDI material | LDPP (IT-180A 1037 and 1086)、general 106 and 1080 | |
| High CTI | Shengyi S1600 | |
| High Tg FR4 | Isola：FR408、FR408HR、IS410、FR406、GETEK、PCL-370HR； | |
| Iteq：IT-180A、IT-150DA； Nelco：N4000-13、N4000-13EP、N4000-13SI、N4000-13EPSI； | ||
| Panasonic:R-5775K (Megtron6)、R-5725 (Megtron4)；Kingboard：KB6167F； | ||
| EMC：EM-827； Grace：GA-170；NanYa：NP-180；TUC：TU-752、TU-662； | ||
| Hitachi：MCL-BE-67G (H)、MCL-E-679 (W)、 MCL-E-679F (J)；Ventec：VT-47； | ||
| Ceramic powder is filled with high-frequency material | Rogers：Rogers4350、Rogers4003;Arlon:25FR、25N; | |
| Polytetrafluoroethylene high frequency material | Rogers series、Taconic series、Arlon series、Nelco series、TP series | |
| PTFE prepreg | Taconic：TP series、TPN series、HT1.5(1.5mil)、Fastrise series | |
| Material mixed laminated | Rogers、Taconic、Arlon、Nelco and FR-4 |
| Item | Specific | Capability |
| Surface treatment | Lead free | Electroplating copper nickel gold、ENIG、Hard gold plating (with/without nickel)、Gold finger plating、 |
| HASL LF、OSP、ENEPIG、 Soft gold plating (with/without nickel)、Immersion silver、Immersion tin、 | ||
| ENIG+OSP、ENIG+G/F、Full board ENIG+Gold finger、Immersion silver+gold finger、Immersion tin+gold finger. | ||
| Leaded | HASL | |
| Ratio of thickness : hole size | 10：1 for (HASL/HASL LF，ENIG，Immersion silver，Immersion tin，ENEPIG)；8：1 for (OSP) | |
| Working size(MAX) | ENIG：520*800mm，Vertical immersion tin：500*600mm、Horizontal immersion tin：all edges ＜ 500mm； | |
| Horizontal immersion silver：all edges ＜ 500mm；HASL/HASL LF：520*650mm； | ||
| OSP：all edges ＜ 500mm；Electroplated hard gold：450*500mm； all edges ＜ 520mm | ||
| Working size(MIN) | Immersion tin：60*80mm；Immersion silver：60*80mm；HASL/HASL LF：150*230mm；OSP：60*80mm； | |
| Board thickness | Immersion gold：0.2-7.0mm，Immersion tin：0.3-7.0mm (Vertical immersion tin)、0.3-3.0mm (Horizontal line)； | |
| Immersion silver：0.3-3.0mm；HASL/HASL LF：0.6-3.5mm； | ||
| Thickness below 0.4mm for HASL/HASL LF needs to be reviewed； | ||
| OSP：0.3-3.0mm；Electroplated hard gold：0.3-5.0mm | ||
| Min. Space between IC pads or PAD to trace (ENIG boards) | 3mil | |
| Max. height for gold finger | 1.5inch | |
| Minimum distance between gold fingers | 6mil | |
| Segment gold finger minimum segment spacing | 7.5mil | |
| Drilling | Max. Board thickness for 0.1/0.15/0.2mm mechanical drill | 0.8mm/1.5mm/2.5mm |
| Min. Hole size for Laser drilling | 0.075mm | |
| Max. Hole size for Laser drilling | 0.15mm | |
| Hole size for mechanical drilling | 0.10-6.2mm (corresponding drill bit 0.15-6.3mm) | |
| PTFE material (include mixed press)board，min. Hole size is 0.25mm (corresponding drill bit 0.35mm) | ||
| Hole size for mechanical buried and blind holes ≤ 0.3mm (corresponding drill bit 0.4mm) | ||
| Solder mask filled vias in PAD, hole size ≤ 0.45mm (corresponding drill bit 0.55mm) | ||
| Min. hole size for the connecting holes 0.35mm (corresponding drill bit 0.45mm) | ||
| Min. hole size for plated half hole: 0.30mm (corresponding drill bit 0.4mm) | ||
| Max. Ratio for thickness : hole size (through hole board) | 20:1(exclude ≤ 0.2mm drill bit；＞12:1 need review) | |
| Max. Ratio for depth : laser hole size | 1:01 | |
| Max. Ratio for depth : hole size (mechanical depth drill) | 1.3:1(hole size≤0.20mm),1.15:1(hole size≥0.25mm) | |
| Min. Depth for mechanical depth drill (back drill) | 0.2mm | |
| Min. Distance between mechanical hole and trace (Not buried/blind holes board,or 1 stage laser blind hole) | 5.5mil(≤8 layers)；6.5mil (10-14)；7mil(＞14 layers) | |
| Min. Distance between mechanical hole and trace (buried/blind holes board,or 2 stage laser blind hole) | 7mil (one time press)；8mil(two times press)；9mil(three times press) | |
| Min. Distance between mechanical hole and trace (laser buried/blind hole) | 7mil (1+N+1)；8mil (1+1+N+1+1 or 2+N+2) | |
| Min. Distance between laser hole and trace (1 and 2 stage HDI board) | 5mil | |
| Min. Distance between PTH holes (after compensation) in different network | 10mil | |
| Min. Distance between PTH holes (after compensation) in same network | 6mil(through hole；laser blind hole)；10mil (mechanical buried/blind holes) | |
| Min. Distance between NPTH holes (after compensation) | 8mil | |
| Hole position tolerance | ±2mil | |
| Min. tolerance for NPTH hole size | ±2mil | |
| Min. tolerance for pressfit holes size | ±2mil | |
| Tolerance for depth of countersink holes | ±0.15mm | |
| Tolerance for hole mouth size of countersink hole | ±0.15mm |
| Item | Specific | Capability |
| Metal material | Layers | Aluminum base、Copper base：1-8 layers； |
| Cold board, sintered board, buried metal board：2-24 layers；Ceramic board：1-2 layers； | ||
| Finish size (Aluminum base、Copper base、Cold board, sintered board, buried metal board) | MAX:610*610mm、MIN:5*5mm | |
| Max. Size (ceramic board) | 100*100mm | |
| Finish board thickness | 0.5-5.0mm | |
| Copper thickness | 0.5-10 OZ | |
| Metal base thickness | 0.5-4.5mm | |
| Metal base | AL：1100/1050/2124/5052/6061；Copper：red copper pure iron | |
| Min. Finish hole size and tolerance | NPTH：0.5±0.05mm；PTH(Aluminum base、Copper base)：0.3±0.1mm； | |
| PTH(Cold board, sintered board, buried metal board)：0.2±0.10mm； | ||
| Outline tolerance | ±0.2mm | |
| PCB surface treatment | HASL / HASL LF；OSP；ENEPIG；Electrical (nickel) Soft/hard gold；Tin plating； | |
| Nickel free electroplating soft and hard gold；Thick gold | ||
| Metal surface treatment | Copper: plated nickel gold; Aluminum: anodic oxidation, hard oxidation, chemical passivation; | |
| Mechanical treatment: dry sand blasting, wire drawing | ||
| Metal base material | Totking (T-110、T-111)；Ventec aluminum base (VT-4A1、VT-4A2、VT-4A3)； | |
| Laird aluminum base (1KA04、1KA06)； | ||
| Bergquist aluminum base (MP06503、HT04503)；TACONIC metal base (TLY-5、TLY-5F)； | ||
| Thermally Conductive Adhesive thickness (dielectric layer) | 75-150um | |
| Embedding copper size- | 3*3mm—70*80mm | |
| Embedding copper ingot (drop height accuracy) | ±40um | |
| Distance from copper block to hole wall | ≥12mil | |
| Thermal Conductivity | 0.3-3W/m.k (Aluminum base、Copper base、Cold board)；8.33W/m.k (Sintered board)； | |
| 0.35-30W/m.k (Buried metal board)；24-180W/m.k (Ceramic board)； | ||
| Product type | Rigid board | Backplane, HDI, Multilayer blind and buried hole, Thick copper, Power thick copper, Semiconductor test board |
| Stackup type | Multiple pressing blind and buried hole | Same side press quantity ≤ 3 times |
| HDI board type | 1+n+1、1+1+n+1+1、2+n+2、3+n+3(buried hole in “n” ≤ 0.3mm)，Laser blind holes can be electroplated and filled. | |
| Local mixed pressure | Minimum distance from mechanical drilling to conductor (in local mixed pressure area) | ≤10 layers：14mil；12 layers：15mil；＞12 layers：18mil |
| Minimum distance between local mixed pressure junction and hole | ≤12 layers：12mil；＞12 layers：15mil |
| Item | Specific | Capability |
| PAD (Annular ring) | Min. Pad size for inner layer and outer layer (laser hole) | 10mil (4mil laser hole)，11mil (5mil laser hole) |
| Min. Pad size for inner layer and outer layer (mechanical hole) | 16mil (8mil hole size) | |
| Min. BGA pad size | 10mil for HASL surface，12mil for HASL lead free surface，7mil for other surface. | |
| PAD tolerance (BGA) | +/-1.2mil (PAD＜12mil)；+/-10% (PAD≥12mil) | |
| Trace width / space | Min. trace width for different copper thickness | 1/2OZ：3/3mil |
| 1OZ: 3/4mil | ||
| 2OZ: 5/5mil | ||
| 3OZ: 7/7mil | ||
| 4OZ: 12/12mil | ||
| 5OZ: 16/16mil | ||
| 6OZ: 20/20mil | ||
| 7OZ: 24/24mil | ||
| 8OZ: 28/28mil | ||
| 9OZ: 30/30mil | ||
| 10OZ: 32/30mil | ||
| Tolerance for trace width | ≤10mil：+/-1.0mil | |
| ＞10mil：+/-1.5mil | ||
| Solder mask & silkscreen | Max. Hole size for solder mask filled vias (two sides of vias covered with solder mask) | 0.5mm |
| Solder mask color | Green,yellow,black,blue,red,white,purple,matte green,matte black,High refraction white oil | |
| Silkscreen color | White,yellow,black | |
| Max. Hole size for peelable mask | 5mm | |
| Hole size scope for epoxy filled holes | 0.1-1.0mm | |
| Max. ratio of thickness : hole size for epoxy filled holes | 12:01 | |
| Min. solder mask bridge width | Green color : 4mil、other color : 6mil | |
| Min. line width of silkscreen | White color : 3mil Height : 24mil； Black color : 5mil Height : 32mil | |
| Min. spacing between hollow characters | Hollow width 8mil Height : 40mil | |
| Solder mask hollow characters | Hollow width 8mil Height : 40mil | |
| Outline | Min. space between V-cut center line and copper (avoid copper exposed) | H≤1.0mm:0.3mm(20 degree is V-CUT angle)、0.33mm(30 degree)、0.37mm(45 degree); |
| 1.0＜H≤1.6mm:0.36mm(20 degree)、0.4mm(30 degree)、0.5mm(45 degree); | ||
| 1.6＜H≤2.4mm:0.42mm(20 degree)、0.51mm(30 degree)、0.64mm(45 degree); | ||
| 2.4＜H≤3.2mm:0.47mm(20 degree)、0.59mm(30 degree)、0.77mm(45 degree); | ||
| Tolerance of V-cut symmetry | ±4mil | |
| Max. quantity of V-cut lines | 100 lines | |
| Tolerance of V-cut angle | ±5 degree | |
| General angles of V-cut | 20、30、45 degree | |
| Chamfer angle for gold finger | 20、30、45 degree | |
| Tolerance of chamfer angle for gold finger | ±5 degree | |
| Min. distance between TAB and gold finger without getting hurt | 6mm | |
| Min. distance between gold finger edge and board edge | 8mil | |
| Depth tolerance for depth rout slot (NPTH) | ±0.10mm | |
| Tolerance for outline (edge to edge) | ±8mil | |
| Min. Tolerance for milling slot (PTH) | Slot width and slot length : ±0.15mm | |
| Min. Tolerance for milling slot (NPTH) | Slot width and slot length : ±0.10mm | |
| Min. Tolerance for drilling slot (PTH) | Slot width ± 0.075mm； | |
| Slot length / slot width <2, then slot length +/-0.1mm；Slot length / slot width ≥2, then slot length +/-0.075mm | ||
| Min. Tolerance for drilling slot (NPTH) | Slot width ±0.05mm； | |
| Slot length / slot width <2, then slot length +/-0.075mm；Slot length / slot width ≥2, then slot length +/-0.05mm |
